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Technical Sessions Room A:


Time: 9:00 am to 9:45 am
Topic: Properly defining your environmental chamber requirements will insure the best ROI
Presented by: Fred Rombold – Cincinnati Sub-Zero
Sponsored by: RDP


Time: 10:15 am to 11:00 am
Topic: The Next Generation in Communication and Data I/O – The Two Technologies from Sixnet I/O that extend the reach of Ethernet and make your Job easier
Presented by: Howard Greer - Technical Product Specialist, Sixnet I/O
Sponsored by: Meta Technical Sales


Time: 1:00 pm to 1:45 pm
Topic: Automotive Durability Testing using Piezoelectric Force Sensors
Presented by: Ken Watkins – Force Product Manager
Sponsored by: PCB Piezotronics




Technical Sessions Room B:


Time: 9:15 am to 10:00 am
Topic: Selection of non-contact displacement measurement technology
Presented by: MTI Instruments, Inc. - Paul Slazas, Product Sales Manager
Sponsored by: Instrumentation Systems, Inc.


Time: 10:30 am to 11:15 am
Topic: An Overview of the Latest Test Methodologies for High Speed Serial Designs with Oscilloscope Based Solutions by LeCroy
Presented by: Mike Turner with Lecroy
Sponsored by: DYTEC/East


Time: 1:15 pm to 2:00 pm
Topic: ANSI Z540.3 Standard Comparison with ISO 17025 Laboratory Accreditation Standard
Presented by: Dilip A. Shah, E = mc3 Solutions
Sponsored by: Broadview Instrumentation







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Tuesday
Sept. 23, 2008

Show &
Technical Sessions:
9:00 am to 3:00 pm

Buffet Lunch:
11:00 am to 2:00 pm

 
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